KD Series - Double Sided Flexible Copper Clad Laminates (FCCL), Flexible PCB

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Item Unit
KDD1212ME1
KDD1225ME1
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 3,000
> 2,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 3,000
> 2,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1825ME1
KDD1850ME1
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSA

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 1,000
> 100
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 1,000
> 100
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 4
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1225HE1
KDD1825HE1
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSA

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 2,000
> 1,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 2,000
> 1,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1212FE3
KDD1225FE3
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 2,000
> 1,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 2,000
> 1,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1225FE5
Test Method

Coefficient of Thermal Expansion

ppm
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
DSC

Flame Resistance

-
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 1,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 1,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1225JA1
KDD1825JA1
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 2,000
> 1,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 2,000
> 1,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃, 10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1225JA2
KDD1825JA2
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 2,000
> 1,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 2,000
> 1,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1250JAD
KDD1212JAE
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.7
> 0.8
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 100
> 5,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 100
> 5,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 4
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1225JAE
KDD1250JAE
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 0.7
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 3,000
> 200
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 3,000
> 200
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 4
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD0612JAF
KDD0625JAF
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.6
>0.7
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 6,000
> 3,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 6,000
> 3,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1225JAK
KDD1250JAK
Test Method

Coefficient of Thermal Expansion

ppm
18±4
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
> 300
DSC

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 2,000
> 100
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 2,000
> 100
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
KDD1825JAK
Test Method

Coefficient of Thermal Expansion

ppm
18±4
TMA

PL Glass Transition Temperature (TG)

> 300
DSC

Flame Resistance

-
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 150
IPC-TM-650,
2.4.19

Elongation

%
> 45
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 1.0
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 500
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 500
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
350℃,
10 sec

Surface Resistance

Ω
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
IPC-TM-650,
2.5.6.2

Remark:

This information is based upon technical information believed to be reliable. However, no guarantee or warranty is expressed or implied with respect to the information herein.
  • Outstanding flexibilities
  • Immense mechanical strengths
  • Excellent dimensional stability
  • Excellent electrical performance
  • Excellent chemical resistance
  • Remarkable thermal stabilities
  • Excellent flame resistance
  • Low moisture absorption
  • Multiple copper foil choices
 
Configurations
 
  • Traditional flex circuits
  • High density flex circuits
  • Multi-layer rigid-flex wiring
  • Chip on film (COF) substrate
  • Chip scale packaging (CSP)
  • Ball grid array (BGA)
  • Tape automatic bonding (TAB)
  • PDP driver IC packaging
 
   

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