Flexible Printed Circuit Board

Flexible PCB Manufacturer in Taiwan

AD Series - Single Sided Flexible Copper Clad Laminates (FCCL)

AD Series - Single Sided Flexible Copper Clad Laminates (FCCL), Flexible PCB

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Item Unit
ADS1212ME1
ADS1220ME1
Test Method

Coefficient of Thermal Expansion

ppm
18±2
18±2
TMA

Glass Transition Temperature

> 350
> 350
TMA

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 230
> 230
IPC-TM-650,
2.4.19

Elongation

%
> 40
> 40
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.8
> 0.8
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 5,000
> 4,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 5,000
> 4,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
340℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225ME1
ADS1850ME1
Test Method

Coefficient of Thermal Expansion

ppm
18±2
18±2
TMA

Glass Transition Temperature

> 350
> 350
TMA

Flame Resistance

-
V-0
V-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 230
> 230
IPC-TM-650,
2.4.19

Elongation

%
> 40
> 40
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.8
> 0.7
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 4,000
> 100
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 4,000
> 100
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
340℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1212JA1
ADS1812JA1
Test Method

Coefficient of Thermal Expansion

ppm
18±2
18±2
TMA

Glass Transition Temperature

> 350
> 350
TMA

Flame Resistance

-
VTM-0
VTM-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.1
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.1
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 230
> 230
IPC-TM-650,
2.4.19

Elongation

%
> 40
> 40
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.7
> 0.7
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 8,000
> 5,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 8,000
> 5,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
340℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1825JA1
ADS1850JA1
Test Method

Coefficient of Thermal Expansion

ppm
18±2
18±2
TMA

Glass Transition Temperature

> 350
> 350
TMA

Flame Resistance

-
V-0
V-0
UL 94

Dimensional Stability (MD)

%
within ±
0.05
within ±
0.05
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.05
within ±
0.05
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 230
> 230
IPC-TM-650,
2.4.19

Elongation

%
> 40
> 40
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.7
> 0.7
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 2,000
> 100
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 2,000
> 100
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
340℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225JAE
ADS1850JAE
Test Method

Coefficient of Thermal Expansion

ppm
20±4
20±4
TMA

Glass Transition Temperature

> 350
> 350
TMA

Flame Resistance

-
V-0
V-0
UL 94

Dimensional Stability (MD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.08
within ±
0.08
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 230
> 230
IPC-TM-650,
2.4.19

Elongation

%
> 40
> 40
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.7
> 0.7
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 5,000
> 200
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 5,000
> 200
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
340℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225JAK
ADS1850JAB
Test Method

Coefficient of Thermal Expansion

ppm
18±2
18±2
TMA

Glass Transition Temperature

> 350
> 350
TMA

Flame Resistance

-
V-0
V-0
UL 94

Dimensional Stability (MD)

%
within ±
0.05
within ±
0.05
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.05
within ±
0.05
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 230
> 230
IPC-TM-650,
2.4.19

Elongation

%
> 40
> 40
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.7
> 0.8
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 4,000
> 3,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 4,000
> 3,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
PASS
340℃,
10 sec

Surface Resistance

Ω
>1014
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
> 5
IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225JAL
Test Method

Coefficient of Thermal Expansion

ppm
18±2
TMA

Glass Transition Temperature

> 350
TMA

Flame Resistance

-
V-0
UL 94

Dimensional Stability (MD)

%
within ±
0.05
IPC-TM-650,
2.2.4

Dimensional Stability (TD)

%
within ±
0.05
IPC-TM-650,
2.2.4

Tensile Strength

MPa
> 230
IPC-TM-650,
2.4.19

Elongation

%
> 40
IPC-TM-650,
2.4.19

Peeling Strength

kN/m
> 0.7
JIS C-5016

Flexural Endurance (MIT) (MD)

Cycles
> 4,000
JIS C-6471

Flexural Endurance (MIT) (TD)

Cycles
> 4,000
L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

-
PASS
340℃,
10 sec

Surface Resistance

Ω
>1014
IPC-TM-650,
2.5.17

Flame Resistance

Ω-cm
>1014
IPC-TM-650,
2.5.17

Dielectric Strength

kV/mil
> 5
IPC-TM-650,
2.5.6.2

Remark:

This information is based upon technical information believed to be reliable. However, no guarantee or warranty is expressed or implied with respect to the information herein.
  • Outstanding flexibilities
  • Immense mechanical strengths
  • Excellent dimensional stability
  • Excellent electrical performance
  • Excellent chemical resistance
  • Remarkable thermal stabilities
  • Excellent flame resistance
  • Low moisture absorption
  • Multiple copper foil choices
 
Configurations

  • Traditional flex circuits
  • High density flex circuits
  • Chip on film (COF) substrate
  • Chip scale packaging (CSP)
  • Ball grid array (BGA)
  • Tape automatic bonding (TAB)
  • PDP driver IC packaging
 
   

AZOTEK CO., LTD.
  • No.10-1, Kungyeh 1st Rd., Guanyin Dist., Taoyuan City 328, Taiwan