Flexible Printed Circuit Board

Flexible PCB Manufacturer in Taiwan

UD Series - Double Sided Flexible Copper Clad Laminates (FCCL)
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Product Usage
UD Series - Double Sided Flexible Copper Clad Laminates (FCCL), Flexible PCB


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Item Unit
UDD0938ME1
UDD1225ME1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±4
18±4
 TMA

PL Glass Transition Temperature (TG)

 ℃
> 300
> 300
 DMA

Flame Resistance

 -
V-0
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 300
> 300
 IPC-TM-650,
2.4.19

Elongation

 %
> 50
> 50
 IPC-TM-650,
2.4.19

Peeling Strength

 kgf/cm
> 1.0
> 1.0
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 1,000
> 1,000
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 1,000
> 1,000
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 315℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 3.5
> 3.5
 IPC-TM-650,
2.5.6.2

 

Item Unit
UDD1250ME1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±4
 TMA

PL Glass Transition Temperature (TG)

 ℃
> 300
 DMA

Flame Resistance

 -
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 300
 IPC-TM-650,
2.4.19

Elongation

 %
> 50
 IPC-TM-650,
2.4.19

Peeling Strength

 kgf/cm
> 1.0
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 100
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 100
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
 315℃,
10 sec

Surface Resistance

 Ω
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 3.5
 IPC-TM-650,
2.5.6.2

 

Item Unit
UDD1225NE5
UDD1238NE5
 Test Method

Coefficient of Thermal Expansion

 ppm
18±4
18±4
 TMA

PL Glass Transition Temperature (TG)

 ℃
> 300
> 300
 DMA

Flame Resistance

 -
V-0
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 300
> 300
 IPC-TM-650,
2.4.19

Elongation

 %
> 50
> 50
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 1.0
> 1.0
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 1,000
> 1,000
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 1,000
> 1,000
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 315℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 3.5
> 3.5
 IPC-TM-650,
2.5.6.2

 

Item Unit
UDD1250HE1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±4
 TMA

PL Glass Transition Temperature (TG)

 ℃
> 300
 DMA

Flame Resistance

 -
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 300
 IPC-TM-650,
2.4.19

Elongation

 %
> 50
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 1.0
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 100
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 100
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
 315℃,
10 sec

Surface Resistance

 Ω
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 3.5
 IPC-TM-650,
2.5.6.2

 

Item Unit
UDD1850JA1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±4
 TMA

PL Glass Transition Temperature (TG)

 ℃
> 300
 DMA

Flame Resistance

 -
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 300
 IPC-TM-650,
2.4.19

Elongation

 %
> 50
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 1.0
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 500
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 500
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
 315℃,
10 sec

Surface Resistance

 Ω
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 3.5
 IPC-TM-650,
2.5.6.2

 

Item Unit
UDD1250JA2
 Test Method

Coefficient of Thermal Expansion

 ppm
18±4
 TMA

PL Glass Transition Temperature (TG)

 ℃
> 300
 DMA

Flame Resistance

 -
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 300
 IPC-TM-650,
2.4.19

Elongation

 %
> 50
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 1.0
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 100
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 100
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
 315℃,
10 sec

Surface Resistance

 Ω
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 3.5
 IPC-TM-650,
2.5.6.2

Remark:

This information is based upon technical information believed to be reliable. However, no guarantee or warranty is expressed or implied with respect to the information herein.
  • Outstanding flexibilities
  • Immense mechanical strengths
  • Excellent dimensional stability
  • Excellent electrical performance
  • Excellent chemical resistance
  • Remarkable thermal stabilities
  • Excellent flame resistance
  • Low moisture absorption
  • Multiple copper foil choices
 
Configurations
 

  • Traditional flex circuits
  • High density flex circuits
  • Multi-layer rigid-flex wiring
  • Chip on film (COF) substrate
  • Chip scale packaging (CSP)
  • Ball grid array (BGA)
  • Tape automatic bonding (TAB)
  • PDP driver IC packaging
 
   

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