Flexible Printed Circuit Board

Flexible PCB Manufacturer in Taiwan

AD Series - Single Sided Flexible Copper Clad Laminates (FCCL)
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Main Products
AD Series
KD Series
UD Series
LD Series
Product Usage
AD Series - Single Sided Flexible Copper Clad Laminates (FCCL), Flexible PCB


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Item Unit
ADS1212ME1
ADS1220ME1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±2
18±2
 TMA

Glass Transition Temperature

 ℃
> 350
> 350
 TMA

Flame Resistance

 -
VTM-0
VTM-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 230
> 230
 IPC-TM-650,
2.4.19

Elongation

 %
> 40
> 40
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 0.8
> 0.8
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 5,000
> 4,000
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 5,000
> 4,000
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 340℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 5
> 5
 IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225ME1
ADS1850ME1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±2
18±2
 TMA

Glass Transition Temperature

 ℃
> 350
> 350
 TMA

Flame Resistance

 -
V-0
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 230
> 230
 IPC-TM-650,
2.4.19

Elongation

 %
> 40
> 40
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 0.8
> 0.7
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 4,000
> 100
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 4,000
> 100
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 340℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 5
> 5
 IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1212JA1
ADS1812JA1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±2
18±2
 TMA

Glass Transition Temperature

 ℃
> 350
> 350
 TMA

Flame Resistance

 -
VTM-0
VTM-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
within ±
0.1
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
within ±
0.1
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 230
> 230
 IPC-TM-650,
2.4.19

Elongation

 %
> 40
> 40
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 0.7
> 0.7
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 8,000
> 5,000
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 8,000
> 5,000
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 340℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 5
> 5
 IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1825JA1
ADS1850JA1
 Test Method

Coefficient of Thermal Expansion

 ppm
18±2
18±2
 TMA

Glass Transition Temperature

 ℃
> 350
> 350
 TMA

Flame Resistance

 -
V-0
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.05
within ±
0.05
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.05
within ±
0.05
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 230
> 230
 IPC-TM-650,
2.4.19

Elongation

 %
> 40
> 40
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 0.7
> 0.7
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 2,000
> 100
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 2,000
> 100
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 340℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 5
> 5
 IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225JAE
ADS1850JAE
 Test Method

Coefficient of Thermal Expansion

 ppm
20±4
20±4
 TMA

Glass Transition Temperature

 ℃
> 350
> 350
 TMA

Flame Resistance

 -
V-0
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.08
within ±
0.08
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 230
> 230
 IPC-TM-650,
2.4.19

Elongation

 %
> 40
> 40
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 0.7
> 0.7
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 5,000
> 200
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 5,000
> 200
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 340℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 5
> 5
 IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225JAK
ADS1850JAB
 Test Method

Coefficient of Thermal Expansion

 ppm
18±2
18±2
 TMA

Glass Transition Temperature

 ℃
> 350
> 350
 TMA

Flame Resistance

 -
V-0
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.05
within ±
0.05
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.05
within ±
0.05
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 230
> 230
 IPC-TM-650,
2.4.19

Elongation

 %
> 40
> 40
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 0.7
> 0.8
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 4,000
> 3,000
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 4,000
> 3,000
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
PASS
 340℃,
10 sec

Surface Resistance

 Ω
>1014
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 5
> 5
 IPC-TM-650,
2.5.6.2

 

Item Unit
ADS1225JAL
 Test Method

Coefficient of Thermal Expansion

 ppm
18±2
 TMA

Glass Transition Temperature

 ℃
> 350
 TMA

Flame Resistance

 -
V-0
 UL 94

Dimensional Stability (MD)

 %
within ±
0.05
 IPC-TM-650,
2.2.4

Dimensional Stability (TD)

 %
within ±
0.05
 IPC-TM-650,
2.2.4

Tensile Strength

 MPa
> 230
 IPC-TM-650,
2.4.19

Elongation

 %
> 40
 IPC-TM-650,
2.4.19

Peeling Strength

 kN/m
> 0.7
 JIS C-5016

Flexural Endurance (MIT) (MD)

 Cycles
> 4,000
 JIS C-6471

Flexural Endurance (MIT) (TD)

 Cycles
> 4,000
 L/S=1.0 mm,
R=0.8 mm

Soldering Resistance

 -
PASS
 340℃,
10 sec

Surface Resistance

 Ω
>1014
 IPC-TM-650,
2.5.17

Flame Resistance

 Ω-cm
>1014
 IPC-TM-650,
2.5.17

Dielectric Strength

 kV/mil
> 5
 IPC-TM-650,
2.5.6.2

Remark:

This information is based upon technical information believed to be reliable. However, no guarantee or warranty is expressed or implied with respect to the information herein.
  • Outstanding flexibilities
  • Immense mechanical strengths
  • Excellent dimensional stability
  • Excellent electrical performance
  • Excellent chemical resistance
  • Remarkable thermal stabilities
  • Excellent flame resistance
  • Low moisture absorption
  • Multiple copper foil choices
 
Configurations

  • Traditional flex circuits
  • High density flex circuits
  • Chip on film (COF) substrate
  • Chip scale packaging (CSP)
  • Ball grid array (BGA)
  • Tape automatic bonding (TAB)
  • PDP driver IC packaging
 
   

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